Laser soldering machine，For tiny gap soldering, small pad soldering, and other unreachable position soldering，Compact design with high quality laser system，Optional for 60W 130W diode laser，Strong & b
For tiny gap soldering, small pad soldering, and other unreachable position soldering
Compact design with high quality laser system
Optional for 60W 130W diode laser
Strong & brisk laser process control system
A co-axis camera assist the solder process improve & produce record
Hight accuracy control
protect sensitive elements & fragile pad or solder joint from laser energy
non-contact measurement & detective
Easy to solder uncomment or complex geometric solder pad or solder area
Flexable（SMT,THT,FPC, Wire to Pin/pad)
Programable process path for different solder joint on sameone PCB or products Can make different solder Temperature process for different demand Dynamic control laser output to achieve the setting temperature
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simplify process setting
-导热性未知 Unknow Heat transfer on PCB or pad
-激光能量根据确定的温度实时调整 Dynamic laser energy output according to setting temperature
能量损失 Power compensate
-温度控制系统随时补偿激光能量的流失 Temperature control system compensate power during process dynamically for temperature sink during soldering
增加焊接的工艺可靠性 Helping to make reliable solder process
1.预防加热过度以及加热不足 prevent over-heat or cold solder joint
2.预防PCB基底的烧焦 Prevent burning PCB or substage
3.补偿锡丝供给的误差 compensate on solder wire feeding
激光焊接是最灵活的焊接技术之一Laser soldering is one of the most flexible soldering tools
焊点直径0.2～5mm feasible for 0.2-5mm solder pad
应用于焊锡丝，锡膏焊以及预成型焊接 Suitable for solder wire, paste, pre-tin process
适用锡线∅0.3mm、∅0.5mm、∅0.8mm、∅1.0mm、∅1.2mm
Adaption wire dimension: ∅0.3mm、∅0.5mm、∅0.8mm、∅1.0mm、∅1.2mm
微小焊点 Tiny pad 受限空间 Limited space 温度敏感零部件 Sensitive components 吸热部件 Heat sink parts or big metal parts
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极短加工周期 Quick process 不同的形状 different solder pad 空间受限的焊点 space limited solder joint 在焊脚处焊接以防PCB板底的烧伤 beam on the pad avoid harm underneath parts or elements 精准的自动定位可供选择 flexible location for heat transfer
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精准的布局加热 precise power distribut 预防过度加热 prevent over-heat
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复杂焊缝形状的非接触式加热non- contact heat-up for Complex solder joint 带涂层焊丝 Solder part with coating layer 激光可首先融化掉涂层 Laser quickly melt the layer then solder
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非接触的情况下，各种焊丝都可用于自动焊接Various wire can solder to the pad via non-contact laser soldering
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ILIKELEO
Leopeng_keentec
diana@rainbowseamaterial.com