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High-precision X-Ray Inspection System X-7900

Quick Overview

The X-Ray family of testing devices High-precision, nondestructive testing system

Semiconductor packaging, automotive industry, LED, lithium battery

PCBA assemble

X-7900 electronic semiconductor test equipment can be used to detect integrated circuit chip semiconductor, such as BGA, IGBT, inverted chip and PCBA component welding, LED, photovoltaic and other high precision testing; widely used in industrial manufacturing field, such as automobile parts, casting testing, welding quality testing of pressure vessel and pipe and analysis of new materials; can detect defects of various types of battery, such as power battery, cylinder, flexible packaging, square shell and laminate.


Scope of application (Application):

1. Semiconductor Packaging (Semiconductor packaging)

2. Electronic wire harness (Electronic harness)

3. Lithium battery (lithium battery)

4. Automotive Sensors (C ar sensor)

5. PCB A Assembly (PCBA Assembly)

6. MINI LED Package (MINI LED Package)

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Specification parameters (Specifications):

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High-end configuration (High-end configuration):

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Functional advantage:
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Q uality accessories:
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Principles Description of X-RAY:
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Detection case:
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Inline High-precision X-Ray Inspection System X-7900
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